MSP430FG6626 Datasheet, PDF (162/171 Pages) Texas Instruments – Mixed-Signal Microcontrollers

MSP430FG6626, MSP430FG6625
MSP430FG6426, MSP430FG6425
SLAS874 – MAY 2015
www.ti.com
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, PZP) and temperature range (for example, T). Figure 8-1 provides a legend
for reading the complete device name for any family member.
MSP 430 F 5 438 A I ZQW T XX
Processor Family
Optional: Additional Features
430 MCU Platform
Optional: Tape and Reel
Device Type
Packaging
Series
Feature Set
Optional: Temperature Range
Optional: A = Revision
Processor Family
430 MCU Platform
CC = Embedded RF Radio
MSP = Mixed-Signal Processor
XMS = Experimental Silicon
PMS = Prototype Device
TI’s Low-Power Microcontroller Platform
Device Type
Memory Type
C = ROM
F = Flash
FR = FRAM
G = Flash or FRAM (Value Line)
L = No Nonvolatile Memory
Specialized Application
AFE = Analog Front End
BT = Preprogrammed with Bluetooth
BQ = Contactless Power
CG = ROM Medical
FE = Flash Energy Meter
FG = Flash Medical
FW = Flash Electronic Flow Meter
Series
1 Series = Up to 8 MHz
2 Series = Up to 16 MHz
3 Series = Legacy
4 Series = Up to 16 MHz with LCD
5 Series = Up to 25 MHz
6 Series = Up to 25 MHz with LCD
0 = Low-Voltage Series
Feature Set
Various Levels of Integration Within a Series
Optional: A = Revision
N/A
Optional: Temperature Range
Packaging
S = 0°C to 50°C
C = 0°C to 70°C
I = –40°C to 85°C
T = –40°C to 105°C
http://www.ti.com/packaging
Optional: Tape and Reel
T = Small Reel
R = Large Reel
No Markings = Tube or Tray
Optional: Additional Features -EP = Enhanced Product (–40°C to 105°C)
-HT = Extreme Temperature Parts (–55°C to 150°C)
-Q1 = Automotive Q100 Qualified
Figure 8-1. Device Nomenclature
162 Device and Documentation Support
Copyright © 2015, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: MSP430FG6626 MSP430FG6625 MSP430FG6426 MSP430FG6425