OMAP-L138_11 Datasheet, PDF (132/287 Pages) Texas Instruments – OMAP-L138 C6-Integra DSP+ARM Processor

OMAP-L138
SPRS586C – JUNE 2009 – REVISED MAY 2011
www.ti.com
5.11.3.4 Placement
Figure 5-19 shows the required placement for the device as well as the DDR2/mDDR devices. The
dimensions for Figure 5-20 are defined in Table 5-30. The placement does not restrict the side of the PCB
that the devices are mounted on. The ultimate purpose of the placement is to limit the maximum trace
lengths and allow for proper routing space. For single-memory DDR2/mDDR systems, the second
DDR2/mDDR device is omitted from the placement.
X
A1
Y
OFFSET
Y ^DDR2/mDDR
Device
Y
OFFSET
A1
Recommended DDR2/mDDR
Device Orientation
Figure 5-20. OMAP-L138 and DDR2/mDDR Device Placement
Table 5-30. Placement Specifications⁽¹⁾⁽²⁾
NO. PARAMETER
MIN
MAX
UNIT
1X
1750
Mils
2Y
3 Y Offset
4 Clearance from non-DDR2/mDDR signal to DDR2/mDDR Keepout Region⁽⁴⁾
1280
Mils
(3)₆₅₀
Mils
4
w ⁽⁵⁾
(1) See Figure 5-20 for dimension definitions.
(2) Measurements from center of device to center of DDR2/mDDR device.
(3) For single memory systems it is recommended that Y Offset be as small as possible.
(4) Non-DDR2/mDDR signals allowed within DDR2/mDDR keepout region provided they are separated from DDR2/mDDR routing layers by
a ground plane.
(5) w = PCB trace width as defined in Table 5-29.
132 Peripheral Information and Electrical Specifications
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