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DRV8432_15 Datasheet, PDF (7/42 Pages) Texas Instruments – DRV84x2 Dual Full-Bridge PWM Motor Driver
www.ti.com
DRV8412, DRV8432
SLES242G – DECEMBER 2009 – REVISED DECEMBER 2014
6.4 Thermal Information
DRV8412
DRV8432
THERMAL METRIC(1)
DDW
PACKAGE
DKD
PACKAGE
UNIT
44 PINS
36 PINS
RθJA
Junction-to-ambient thermal resistance
24.5
13.3
(with heat sink)
RθJC(top)
RθJB
ψJT
ψJB
RθJC(bot)
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
7.8
0.4
5.5
13.3
°C/W
0.1
0.4
5.4
13.3
0.2
N/A
(1) for more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
6.5 Package Heat Dissipation Ratings
PARAMETER
RθJC, junction-to-case (power pad / heat slug) thermal
resistance
RθJA, junction-to-ambient thermal resistance
Exposed power pad / heat slug area
DRV8412
1.1 °C/W
25 °C/W
34 mm2
DRV8432
0.9 °C/W
This device is not intended to be used without a
heatsink. Therefore, RθJA is not specified. See the
Thermal Information section.
80 mm2
6.6 Package Power Deratings (DRV8412)(1)
PACKAGE
TA = 25°C
POWER
RATING
DERATING
FACTOR
ABOVE TA =
25°C
44-PIN TSSOP (DDW)
5.0 W
40.0 mW/°C
(1) Based on EVM board layout
TA = 70°C POWER
RATING
3.2 W
TA = 85°C POWER
RATING
2.6 W
TA = 125°C POWER
RATING
1.0 W
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