DRV8432_15 Datasheet, PDF (31/42 Pages) Texas Instruments – DRV84x2 Dual Full-Bridge PWM Motor Driver

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DRV8412, DRV8432
SLES242G – DECEMBER 2009 – REVISED DECEMBER 2014
Thermal Considerations (continued)
The thermal grease thermal resistance can be calculated from the exposed power pad or heat slug area and the
thermal grease manufacturer's area thermal resistance (expressed in °C-in²/W or °C-mm²/W). The approximate
exposed heat slug size is as follows:
• DRV8432, 36-pin PSOP3 …… 0.124 in² (80 mm²)
The thermal resistance of thermal pads is considered higher than a thin thermal grease layer and is not
recommended. Thermal tape has an even higher thermal resistance and should not be used at all. Heat sink
thermal resistance is predicted by the heat sink vendor, modeled using a continuous flow dynamics (CFD) model,
or measured.
Thus the system R_θJA = R_θJC + thermal grease resistance + heat sink resistance.
See the TI application report, IC Package Thermal Metrics (SPRA953), for more thermal information.
10.3.1 DRV8412 Thermal Via Design Recommendation
Thermal pad of the DRV8412 is attached at bottom of device to improve the thermal capability of the device. The
thermal pad has to be soldered with a very good coverage on PCB in order to deliver the power specified in the
datasheet. The figure below shows the recommended thermal via and land pattern design for the DRV8412. For
additional information, see TI application report, PowerPad Made Easy (SLMA004) and PowerPad Layout
Guidelines (SOLA120).
Figure 23. DRV8412 Thermal Via Footprint
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