DRV8432_15 Datasheet, PDF (30/42 Pages) Texas Instruments – DRV84x2 Dual Full-Bridge PWM Motor Driver

DRV8412, DRV8432
SLES242G – DECEMBER 2009 – REVISED DECEMBER 2014
Layout Example (continued)
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B1: Do not block the heat transfer path at bottom side. Clear as much space as possible for better heat spreading.
Figure 22. Printed Circuit Board – Bottom Layer
10.3 Thermal Considerations
The thermally enhanced package provided with the DRV8432 is designed to interface directly to heat sink using
a thermal interface compound, (for example, Ceramique from Arctic Silver, TIMTronics 413, and so forth). The
heat sink then absorbs heat from the ICs and couples it to the local air. It is also a good practice to connect the
heatsink to system ground on the PCB board to reduce the ground noise.
R_θJA is a system thermal resistance from junction to ambient air. As such, it is a system parameter with the
following components:
• R_θJC (the thermal resistance from junction to case, or in this example the power pad or heat slug)
• Thermal grease thermal resistance
• Heat sink thermal resistance
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