BQ24070 Datasheet, PDF (7/26 Pages) Texas Instruments – SINGLE-CHIP CHARGE AND SYSTEM POWER-PATH MANAGEMENT IC

www.ti.com
DEVICE INFORMATION
bq24070RHL
RHL PACKAGE
(TOP VIEW)
bq24070
SLUS694A – MARCH 2006 – REVISED MARCH 2006
STAT1
STAT2
IN
BA T
BA T
ISET2
MODE
CE
2₁
3
4
5
6
7
8
9 ¹⁰
20 ¹⁹
18
17
16
15
14
13
11 ₁₂
GND
PG
OUT
OUT
OUT
TMR
DPPM
TS
TERMINAL
NAME
NO.
IN
4
PG
18
BAT
5, 6
CE
9
DPPM
13
ISET1
10
ISET2
7
OUT
MODE
STAT1
STAT2
TMR
TS
GND
VREF
15, 16, 17
8
2
3
14
12
19, 20
1
VSS
11
TERMINAL FUNCTIONS
I/O
DESCRIPTION
I Charge input voltage
O Power-good status output (open-drain)
I/O Battery input and output.
I Chip enable input (active high)
I Dynamic power-path management set point (account for scale factor)
I/O Charge current set point and precharge and termination set point
I
Charge current set point for USB port. (High = 500 mA, Low = 100 mA) For bq24070, see half-charge
current mode using ISET2.
O Output terminal to the system
I Power source selection input (Low for USB mode current limit)
O Charge status output 1 (open-drain)
O Charge status output 2 (open-drain)
I/O Timer program input programmed by resistor. Disable safety timer and termination by tying TMR to V_REF.
I/O Temperature sense input
I Ground input
O Internal reference signal
Ground input (the thermal pad on the underside of the package) There is an internal electrical connection
–
between the exposed thermal pad and VSS pin of the device. The exposed thermal pad must be
connected to the same potential as the VSS pin on the printed-circuit board. Do not use the thermal pad
as the primary ground input for the device. VSS pin must be connected to ground at all times.
Submit Documentation Feedback
7