BQ24070 Datasheet, PDF (3/26 Pages) Texas Instruments – SINGLE-CHIP CHARGE AND SYSTEM POWER-PATH MANAGEMENT IC

bq24070
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ABSOLUTE MAXIMUM RATINGS⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
SLUS694A – MARCH 2006 – REVISED MARCH 2006
Input voltage
IN (DC voltage wrt (with respect to) VSS)
Input voltage
BAT, CE, DPPM, PG, Mode, OUT, ISET1, ISET2, STAT1,
STAT2, TS, (all DC voltages wrt VSS)
V_REF (DC voltage wrt VSS)
TMR
Input current
Output current
OUT
BAT ⁽²⁾
Output sink current
PG, STAT1, STAT2,
Storage temperature range, T_stg
Junction temperature range, T_J
Lead temperature (soldering, 10 seconds)
bq24070
–0.3 V to 18 V
–0.3 V to 7 V
–0.3 V to V_O(OUT) + 0.3 V
–0.3 V to V_O + 0.3 V
3.5 A
4A
–4 A to 3.5 A
1.5 mA
–65°C to 150°C
–40°C to 150°C
300°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage
values are with respect to the network ground terminal unless otherwise noted.
(2) Negative current is defined as current flowing into the BAT pin.
RECOMMENDED OPERATING CONDITIONS
V_CC Supply voltage (V_IN) ⁽¹⁾
I_AC Input current
T_J Operating junction temperature range
(1) Verify that power dissipation and junction temperatures are within limits at maximum V_CC .
MIN
MAX UNIT
4.35
16 V
2A
–40
125 °C
DISSIPATION RATINGS
PACKAGE
20-pin RHL⁽¹⁾
T_A ≤ 40°C
POWER RATING
1.81 W
DERATING FACTOR
T_A > 40°C
21 mW/°C
θ_JA
46.87 °C/W
(1) This data is based on using the JEDEC High-K board and the exposed die pad is connected to a Cu pad on the board. This is
connected to the ground plane by a 2×3 via matrix.
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