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BQ24070 Datasheet, PDF (2/26 Pages) Texas Instruments – SINGLE-CHIP CHARGE AND SYSTEM POWER-PATH MANAGEMENT IC
bq24070
SLUS694A – MARCH 2006 – REVISED MARCH 2006
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOSFET gates.
DESCRIPTION (CONTINUED)
The MODE pin selects the priority of the input sources. If an input source is not available, then the battery is
selected as the source. With the MODE pin high, the bq24070 attempts to charge from the input at the charge
rate set by ISET1 pin. With the MODE pin low, the bq24070 defaults to USB charging at the charge rate. This
feature allows the use of a single connector (mini-USB cable), where the host programs the MODE pin
according to the source that is connected (AC adaptor or USB port). Table 1 summarizes the MODE pin
function.
Table 1. Power Source Selection Function Summary
MODE STATE
Low
High
AC
ADAPTER
Present
Absent
Present
Absent
MAXIMUM
CHARGE RATE(1)
ISET2
N/A
ISET1
N/A
SYSTEM
POWER
SOURCE
USB
Battery
AC
Battery
USB BOOT-UP
FEATURE
Enabled
Disabled
Disabled
Disabled
(1) Battery charge rate is always set by ISET1, but may be reduced by a limited input source (ISET2 USB mode) and IOUT system load.
ORDERING INFORMATION(1)
TA
–40°C to 125°C
BATTERY
VOLTAGE (V)
4.2
4.2
OUT PIN
Regulated to 4.4 V(4)
Regulated to 4.4 V(4)
PART
NUMBER (2) (3)
bq24070RHLR
bq24070RHLT
STATUS
Production
Production
PACKAGE
MARKING
BRQ
BRQ
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
(2) The RHL package is available in the following options:
R - taped and reeled in quantities of 3,000 devices per reel.
T - taped and reeled in quantities of 250 devices per reel.
(3) This product is RoHS compatible, including a lead concentration that does not exceed 0.1% of total product weight, and is suitable for
use in specified lead-free soldering processes. In addition, this product uses package materials that do not contain halogens, including
bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(4) If AC < VO(OUT-REG), the AC is connected to the OUT pin by a P-FET, (Q1).
2
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