TLC6C5712-Q1_15 Datasheet, PDF (58/64 Pages) Texas Instruments – TLC6C5712-Q1 12-Channel, Full-Diagnostic, Constant-Current-Sink LED Driver With 8-Bit Dot Correction

TLC6C5712-Q1
SLVSCO9A – AUGUST 2015 – REVISED AUGUST 2015
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9 Power Supply Recommendations
The TLC6C5712-Q1 device is qualified for automotive applications. Because of voltage-level limitations, the
device requires a first-stage power supply to provide LED and device power. V_CC and V_(SENSE) voltages can be
provided by the same voltage supply or independent voltage supplies. The supply voltage range is specified in
Recommended Operating Conditions.
10 Layout
10.1 Layout Guidelines
To prevent thermal shutdown, the junction temperature, T_J, must be less than 150°C. If the voltage drop across
the output channels is high, the device power dissipation can be large. The TLC6C5712-Q1 device has very
good thermal performance because of the thermal pad design; however, the PCB layout is also very important to
ensure that the device has good thermal performance. Good PCB design can optimize heat transfer, which is
essential for the long-term reliability of the device.
Use the following guidelines when designing the device layout:
• Maximize the copper coverage on the PCB to increase the thermal conductivity of the board. The major heat-
flow path from the package to the ambient is through copper on the PCB. Maximum copper density is
extremely important when no heat sinks are attached to the PCB on the other side of the package.
• Add as many thermal vias as possible directly under the package ground pad to optimize the thermal
conductivity of the board.
• Use either plated shut or plugged and capped vias for all the thermal vias on both sides of the board to
prevent solder voids. To ensure reliability and performance, the solder coverage should be at least 85%.
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