THS6032 Datasheet, PDF (4/31 Pages) Texas Instruments – LOW-POWER ADSL CENTRAL-OFFICE LINE DRIVER

THS6032
LOW-POWER ADSL CENTRAL-OFFICE LINE DRIVER
SLOS233C – APRIL1999 – REVISED MARCH 2000
functional block diagram (SOIC package)
1OUT ³
19 _VCCH+
18 _2OUT
17 _VCCL+
5
1IN–
–
1IN+ ⁶ +
16
–
2IN–
+ ¹⁵ 2IN+
VCCH– ²
VCCL– ⁴
SHDN1 8
SHDN2 9
12 DGND
NOTE A: Terminals 1, 10, 11, and 20 are internally connected to the thermal pad.
absolute maximum ratings over operating free-air temperature (unless otherwise noted)^†
Supply voltage, V_CC(L) and V_CC(H) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 V
Input voltage, V_I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±V_CCH
Output current, I_O (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 800 mA
Differential input voltage, V_ID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 4 V
Total power dissipation at (or below) 25°C free-air temperature
(see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table
Maximum junction temperature, T_J . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Operating free-air temperature, T_A, C-suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
I-suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 85°C
Storage temperature, T_stg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 125°C
Lead temperature 1,6 mm (1/16 in) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
† _{Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and}
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. VCC(L) must always be less than or equal to VCC(H)
2. The THS6032 incorporates a PowerPAD on the underside of the chip. This acts as a heatsink and must be connected to a thermally
dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which
could permanently damage the device. See the Thermal Information section for more information about utilizing the PowerPAD
thermally enhanced packages.
DISSIPATION RATING TABLE‡
PACKAGE
θ_JA
(°C/W)
θ_JC
(°C/W)
TA = 25°C
POWER RATING
DWP
21.5
0.37
5.8 W
GQE
37.8
4.56
3.3 W
‡ _{This data was taken using 2 oz. trace and copper pad that is soldered directly to a JEDEC}
standard 4 layer 3 in × 3 in PCB.
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