THS6032 Datasheet, PDF (16/31 Pages) Texas Instruments – LOW-POWER ADSL CENTRAL-OFFICE LINE DRIVER

THS6032
LOW-POWER ADSL CENTRAL-OFFICE LINE DRIVER
SLOS233C – APRIL1999 – REVISED MARCH 2000
APPLICATION INFORMATION
thermal information (continued)
The THS6032 is also available in the MicroStar Junior GQE package. Just like the DWP package, the GQE
package utilizes the PowerPAD functionality to improve thermal performance. The GQE package is part of the
new ball-grid array (BGA) family developed by Texas Instruments (TI™). This package allows for even higher
density layouts with virtually no loss in thermal performance. Its construction is similar to the DWP construction
(see Figure 39 (a) and (b)), but utilizes the BGA’s to transfer the heat away from the die.
(TOP VIEW)
(Side VIEW)
Die
(a)
(b)
NOTE: Shaded areas are part of the thermally conductive path.
Figure 39. Views of Thermally Enhanced GQE Package
The PowerPAD packages allows for both assembly and thermal management in one manufacturing operation.
During the surface-mount solder operation (when the leads or balls are being soldered), the thermal areas can
also be soldered to a copper area underneath the package. Through the use of thermal paths within this copper
area, heat can be conducted away from the package into either a ground plane or other heat dissipating device.
This is discussed in more detail in the PCB design considerations section of this document.
The PowerPAD package represents a breakthrough in combining the small area and ease of assembly of
surface mount with the, heretofore, awkward mechanical methods of heatsinking.
Because of its power dissipation, proper thermal management of the THS6032 is required. There are several
ways to properly heatsink both the DWP and GQE packages. There are several TI application notes on how
to best accomplish the thermal mounting scheme required for each package. For the DWP package, refer to
the Texas Instruments Technical Brief, PowerPAD Thermally Enhanced Package, literature number SLMA002.
There is also a more compact technical paper entitled PowerPad Made Easy, literature number SLMA004. For
the GQE – MicroStar Junior package, refer to the MicroStar BGA Packaging Reference Guide, literature number
SSYZ015A and the compact version entitled MicroStar Junior Made Easy, literature number SSYA009. This
literature is available on TI’s web site at http://www.ti.com.
TI is a trademark of Texas Instruments Incorporated.
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