THS6032 Datasheet, PDF (15/31 Pages) Texas Instruments – LOW-POWER ADSL CENTRAL-OFFICE LINE DRIVER

THS6032
LOW-POWER ADSL CENTRAL-OFFICE LINE DRIVER
SLOS233C – APRIL1999 – REVISED MARCH 2000
APPLICATION INFORMATION
class-AB mode operation (continued)
To use the THS6032 in class-AB mode, the user should always connect the V_CC(L) power supply pins to GND.
The internal V_CC(L) paths were not designed for continuous full output current and could possibly fail. The V_CC(H)
paths were designed for the full output currents and thus, should be used for class-AB mode operation.
The performance of the THS6032 while in class-AB mode is very similar to the class-G mode. Figure 7 and
Figures 12 to15 show the THS6032 while in class-AB mode.
device protection features
The THS6032 has two built-in features that protect the device against improper operation. The first protection
mechanism is output current limiting. Should the output become shorted to ground the output current is
automatically limited to the value given in the data sheet. While this protects the output against excessive
current, the device internal power dissipation increases due to the high current and large voltage drop across
the output transistors. Continuous output shorts are not recommended and could damage the device.
Additionally, connection of the amplifier output to one of the high supply rails [ ± V_CC(H) ] can cause failure of the
device and is not recommended.
The second built-in protection feature is thermal shutdown. Should the internal junction temperature rise above
approximately 180°C, the device automatically shuts down. Such a condition could exist with improper heat
sinking or if the output is shorted to ground. When the junction temperature drops below 150°C, the internal
thermal shutdown circuit automatically turns the device back on.
thermal information
The THS6032 is available in a thermally-enhanced DWP package, which is a member of the PowerPAD family
of packages. This package is constructed using a downset leadframe upon which the die is mounted
[see Figure 38(a) and Figure 38(b)]. This arrangement results in the lead frame being exposed as a thermal pad
on the underside of the package [see Figure 38(c)]. Because this thermal pad has direct thermal contact with
the die, excellent thermal performance can be achieved by providing a good thermal path away from the thermal
pad.
DIE
Side View (a)
Thermal
Pad
DIE
End View (b)
Bottom View (c)
NOTE A: The thermal pad is electrically isolated from all terminals in the package.
Figure 38. Views of Thermally Enhanced DWP Package
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