THS6022 Datasheet, PDF (4/38 Pages) Texas Instruments – 250-mA DUAL DIFFERENTIAL LINE DRIVER

THS6022
250-mA DUAL DIFFERENTIAL LINE DRIVER
SLOS225C – SEPTEMBER 1998 – REVISED JANUARY 2000
functional block diagram
Driver 1
1 IN+ ⁴ +
1 IN– ^{5 _}
Driver 2
2 IN+ ¹¹ +
10
2 IN–
_
3 _VCC+
2 _1OUT
1
VCC–
12 _VCC+
13 _{2 OUT}
14 _VCC–
absolute maximum ratings over operating free-air temperature (unless otherwise noted)^†
Supply voltage, V_CC+ to V_CC– . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 V
Input voltage, V_I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± V_CC
Output current, I_O (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400 mA
Differential input voltage, V_ID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 V
Continuous total power dissipation at (or below) T_A = 25°C (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3 W
Operating free air temperature, T_A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 85°C
Storage temperature, T_stg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 125°C
Lead temperature, 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
† _{Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and}
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The THS6022 incorporates a PowerPad on the underside of the chip. This acts as a heatsink and must be connected to a thermal
dissipation plane for proper power dissipation. Failure to do so can result in exceeding the maximum junction temperature, which could
permanently damage the device. See the Thermal Information section of this document for more information about PowerPad
technology.
recommended operating conditions
Supply voltage, VCC+ and VCC _–
Operating free-air temperature, TA
Split supply
Single supply
C Suffix
I Suffix
MIN
± 4.5
9
0
– 40
NOM
MAX
± 16
32
70
85
UNIT
V
°C
4
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