THS6022 Datasheet, PDF (31/38 Pages) Texas Instruments – 250-mA DUAL DIFFERENTIAL LINE DRIVER

THS6022
250-mA DUAL DIFFERENTIAL LINE DRIVER
SLOS225C – SEPTEMBER 1998 – REVISED JANUARY 2000
APPLICATION INFORMATION
PCB design considerations (continued)
More complete details of the PowerPAD installation process and thermal management techniques can be found
in the Texas Instruments technical brief, PowerPAD Thermally Enhanced Package. This document can be found
at the TI web site (www.ti.com) by searching on the key word PowerPAD. The document can also be ordered
through your local TI sales office. Refer to literature number SLMA002 when ordering.
MAXIMUM POWER DISSIPATION
vs
FREE-AIR TEMPERATURE
6
TJ = 150°C
PCB Size = 3” x 3”
5
No Air Flow
4
θ_JA = 37.5°C/W
2 oz Trace and
Copper Pad
3
with Solder
2
1 θ_JA = 97.7°C/W
2 oz Trace and Copper Pad
without Solder
0
–40 –20 0
20 40 60 80 100
TA – Free-Air Temperature – °C
Figure 59. Maximum Power Dissipation vs Free-Air Temperature
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