THS6022 Datasheet, PDF (36/38 Pages) Texas Instruments – 250-mA DUAL DIFFERENTIAL LINE DRIVER

THS6022
250-mA DUAL DIFFERENTIAL LINE DRIVER
SLOS225C – SEPTEMBER 1998 – REVISED JANUARY 2000
PWP (R-PDSO-G**)
20-PIN SHOWN
MECHANICAL INFORMATION
PowerPAD™ PLASTIC SMALL-OUTLINE PACKAGE
0,65
20
0,30
0,19
11
0,10 M
Thermal Pad
(See Note D)
4,50 6,60
4,30 6,20
0,15 NOM
1
10
A
Gage Plane
0°– 8°
0,25
0,75
0,50
1,20 MAX
Seating Plane
0,15
0,10
0,05
PINS **
14
16
20
24
28
DIM
A MAX
5,10
5,10
6,60
7,90
9,80
A MIN
4,90
4,90
6,40
7,70
9,60
4073225/E 03/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusions.
D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane. This pad is electrically
and thermally connected to the backside of the die and possibly selected leads.
E. Falls within JEDEC MO-153
PowerPAD is a trademark of Texas Instruments Incorporated.
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