THS6022 Datasheet, PDF (2/38 Pages) Texas Instruments – 250-mA DUAL DIFFERENTIAL LINE DRIVER

THS6022
250-mA DUAL DIFFERENTIAL LINE DRIVER
SLOS225C – SEPTEMBER 1998 – REVISED JANUARY 2000
description (continued)
The THS6022 is packaged in the patented PowerPAD package. This package provides outstanding thermal
characteristics in a small footprint package, which is fully compatible with automated surface-mount assembly
procedures. The exposed thermal pad on the underside of the package is in direct contact with the die. By simply
soldering the pad to the PWB copper and using other thermal outlets, the heat is conducted away from the
junction.
AVAILABLE OPTIONS
PACKAGED DEVICE
TA
PowerPAD PLASTIC
SMALL OUTLINE†
(PWP)
MicroStar Junior
(GQE)
EVALUATION
MODULE
0°C to 70°C
THS6022CPWP
THS6022CGQE
THS6022EVM
– 40°C to 85°C
THS6022IPWP
THS6022IGQE
—
† _{The PWP packages are available taped and reeled. Add an R suffix to the device type (i.e.,}
THS6022CPWPR)
Terminal Functions
NAME
1OUT
1IN–
1IN+
2OUT
2IN–
2IN+
VCC+
VCC–
NC
TERMINAL
PWP PACKAGE
TERMINAL NO.
2
5
4
13
10
11
3, 12
1, 14
6, 7, 8 ,9
GQE PACKAGE
TERMINAL NO.
A3
F1
D1
A7
F9
D9
B1, B9
A4, A6
NA
2
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