LMH6523_15 Datasheet, PDF (30/33 Pages) Texas Instruments – High Performance Quad DVGA

NJY0054A
SCALE 2.000
B
5.6
5.4
A
PACKAGE OUTLINE
WQFN
WQFN
PIN 1 INDEX AREA
0.5
0.3
10.1
9.9
0.3
0.2
0.8 MAX
SEE TERMINAL
DETAIL
19
18
2X 4
3.51±0.1
C
SEATING PLANE
27
28
50X 0.5
7.5±0.1
2X
8.5
DETAIL
OPTIONAL TERMINAL
TYPICAL
(0.1)
1
54
PIN 1 ID
(OPTIONAL)
45
46
54X
0.5
0.3
54X
0.3
0.2
0.1 C A B
0.05 C
4214993/A 07/2013
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
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