LMH6523_15 Datasheet, PDF (3/33 Pages) Texas Instruments – High Performance Quad DVGA

LMH6523
www.ti.com
SNOSC88 – DECEMBER 2012
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for
availability and specifications.
VALUE
UNIT
Human Body Model
ESD Tolerance ⁽²⁾ Machine Model
2
kV
200
V
Charged Device Model
750
V
Positive Supply Voltage (Pin 3)
–0.6 to 5.5
V
Differential Voltage between Any Two Grounds
<200
mV
Analog Input Voltage Range
–0.6 to 5.5
V
Digital Input Voltage Range
–0.6 to 5.5
V
Output Short circuit Duration (one pin to ground)
Infinite
Junction Temperature
150
°C
Storage Temperature Range
–65 to 150
°C
Soldering Information Infrared or Convection (30 sec)
260
°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not guaranteed. For specified specifications, see the Electrical
Characteristics tables.
(2) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC) Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
RECOMMENDED OPERATING CONDITIONS⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
Supply Voltage (Pin 3)
Differential Voltage Between Any Two Grounds
Analog Input Voltage Range, AC Coupled
Temperature Range ⁽²⁾
Package Thermal Resistance ⁽³⁾
54 pin WQFN
MIN
4.75
0
–40
(θ_JA)
23
NOM
MAX
5.25
<10
V+
85
(θ_JC)
4.7
UNIT
V
mV
V
°C
°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not guaranteed. For specified specifications, see the Electrical
Characteristics tables.
(2) The maximum power dissipation is a function of T_J(MAX), θ_JA. The maximum allowable power dissipation at any ambient temperature is
P_D = (T_J(MAX) – T_A)/ θ_JA. All numbers apply for packages soldered directly onto a PC Board.
(3) Junction to ambient (θ_JA) thermal resistance measured on JEDEC 4 layer board. Junction to case (θ_JC) thermal resistance measured at
exposed thermal pad; package is not mounted to any PCB.
ELECTRICAL CHARACTERISTICS - 5V^{(1) (2)}
The following specifications apply for single supply with V+ = 5V, Maximum Gain (0 Attenuation), R_L = 200Ω, V_OUT = 4V_PPD,
fin = 200 MHz, High Power Mode, Boldface limits apply at temperature extremes.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
DYNAMIC PERFORMANCE
3dBBW −3dB Bandwidth
Output Noise Voltage
V_OUT = 2 VPPD
Source = 100Ω
1.4
GHz
30
nV/√Hz
NF
Noise Figure
Source = 100Ω
8.5
dB
OIP3
OIP2
Output Third Order Intercept Point
Output Second Order Intercept
Point
f = 100 MHz, V_OUT = 4 dBm per tone
f = 200 MHz, V_OUT = 4 dBm per tone
POUT= 4 dBm per Tone, f1 =101 MHz,
f2=203 MHz
53
dBm
49
78
dBm
(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. No guarantee of parametric performance is
indicated in the electrical tables under conditions different than those tested
(2) Negative input current implies current flowing out of the device.
Copyright © 2012, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Links: LMH6523