LPV521_15 Datasheet, PDF (27/33 Pages) Texas Instruments – LPV521 NanoPower, 1.8-V, RRIO, CMOS Input, Operational Amplifier

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11 Device and Documentation Support
LPV521
SNOSB14D – AUGUST 2009 – REVISED DECEMBER 2014
11.1 Device Support
11.1.1 Development Support
LPV521 PSPICE Model, SNOM024
TINA-TI SPICE-Based Analog Simulation Program, http://www.ti.com/tool/tina-ti
TI Filterpro Software, http://www.ti.com/tool/filterpro
DIP Adapter Evaluation Module, http://www.ti.com/tool/dip-adapter-evm
TI Universal Operational Amplifier Evaluation Module, http://www.ti.com/tool/opampevm
Evaluation board for 5-pin, north-facing amplifiers in the SC70 package, SNOA487.
Manual for LMH730268 Evaluation board 551012922-001
11.2 Documentation Support
11.2.1 Related Documentation
For related documentation, see the following:
• Feedback Plots Define Op Amp AC Performance, SBOA015 (AB-028)
• Circuit Board Layout Techniques, SLOA089
• Op Amps for Everyone, SLOD006
• AN-1698 A Specification for EMI Hardened Operational Amplifiers, SNOA497
• EMI Rejection Ratio of Operational Amplifiers, SBOA128
• Capacitive Load Drive Solution using an Isolation Resistor, TIPD128
• Handbook of Operational Amplifier Applications, SBOA092
11.3 Trademarks
PowerWise is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2009–2014, Texas Instruments Incorporated
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