THS8133 Datasheet, PDF (21/23 Pages) Texas Instruments – TRIPLE 10-BIT, 80 MSPS VIDEO D/A CONVERTER WITH TRI-LEVEL SYNC GENERATION

PHP (S-PQFP-G48)
0,50
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THS8133, THS8133A, THS8133B
TRIPLE 10-BIT, 80 MSPS VIDEO D/A CONVERTER
WITH TRI-LEVEL SYNC GENERATION
SLVS204C – APRIL 1999 – REVISED SEPTEMBER 2000
MECHANICAL DATA
PowerPAD™ PLASTIC QUAD FLATPACK
0,27
0,17
25
0,08 M
24
Thermal Pad
(see Note D)
48
13
1
1,05
0,95
12
5,50 TYP
7,20
6,80 ^SQ
9,20
8,80 ^SQ
1,20 MAX
0,15
0,05
Seating Plane
0,08
0,13 NOM
Gage Plane
0,25
0°–ā7°
0,75
0,45
4146927/A 01/98
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusions.
D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane. This pad is electrically
and thermally connected to the backside of the die and possibly selected leads.
E. Falls within JEDEC MO-153
PowerPAD is a trademark of Texas Instruments.
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