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SLK2701 Datasheet, PDF (19/21 Pages) Texas Instruments – OC-48/24/12/3 SONET/SDH MULTIRATE TRANSCEIVER
PZP (S-PQFP-G100)
0,50
75
76
SLK2701
OCĆ48/24/12/3 SONET/SDH MULTIRATE TRANSCEIVER
SLLS518 − DECEMBER 2001
MECHANICAL DATA
PowerPAD PLASTIC QUAD FLATPACK
0,27
0,17
51
0,08 M
50
Thermal Pad
(see Note D)
100
26
0,13 NOM
1
1,05
0,95
1,20 MAX
25
12,00 TYP
14,20
13,80 SQ
16,20
SQ
15,80
0,25
0,15
0,05
0,75
0,45
Seating Plane
0,08
Gage Plane
0°−ā 7°
4146929/A 04/99
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane.
This pad is electrically and thermally connected to the backside of the die and possibly selected leads.
E. Falls within JEDEC MS-026
For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm
PowerPAD is a trademark of Texas Instruments.
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