DAC3484_15 Datasheet, PDF (11/107 Pages) Texas Instruments – DAC3484 Quad-Channel, 16-Bit, 1.25 GSPS Digital-to-Analog Converter (DAC)

www.ti.com
DAC3484
SLAS749D – MARCH 2011 – REVISED SEPTEMBER 2015
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
DACVDD, DIGVDD, CLKVDD
Supply voltage
range ⁽²⁾
VFUSE
IOVDD
AVDD, PLLAVDD
D[15..0]P/N, DATACLKP/N, FRAMEP/N, PARITYP/N, SYNCP/N
DACCLKP/N, OSTRP/N
Pin voltage range⁽²⁾
ALARM, SDO, SDIO, SCLK, SDENB, SLEEP, RESETB, TESTMODE,
TXENABLE
IOUTAP/N, IOUTBP/N, IOUTCP/N, IOUTDP/N
EXTIO, BIASJ
LPF
Peak input current (any input)
Peak total input current (all inputs)
Operating free-air temperature range, T_A: DAC3484
Absolute maximum junction temperature, T_J
Storage temperature range
MIN
MAX
UNIT
–0.5
1.5
V
–0.5
1.5
V
–0.5
4
V
–0.5
4
V
–0.5
IOVDD + 0.5
V
–0.5
CLKVDD + 0.5
V
–0.5
IOVDD + 0.5
V
–1.0
AVDD + 0.5
V
–0.5
AVDD + 0.5
V
0.5
PLLAVDD+0.5V V
20
mA
–30
mA
–40
85
°C
150
°C
–65
150
°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Measured with respect to GND.
6.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-
C101 ⁽²⁾
VALUE
±2000
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
Recommended operating junction temperature
T_J
Maximum rated operating junction temperature⁽¹⁾
T_A Recommended free-air temperature
(1) Prolonged use at this junction temperature may increase the device failure-in-time (FIT) rate.
MIN NOM MAX UNIT
105
°C
125
–40
25
85 °C
Copyright © 2011–2015, Texas Instruments Incorporated
Product Folder Links: DAC3484
Submit Documentation Feedback
11