STCD2400 Datasheet, PDF (4/39 Pages) STMicroelectronics – Multichannel clock distribution circuit

List of figures
List of figures
STCD22x0, STCD23x0, STCD24x0
Figure 1.
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Figure 16.
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Figure 27.
Figure 28.
Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Hardware hookup (master clock enable active low) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Hardware hookup (master clock enable active high) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Connections diagram Flip Chip 12-bump (STCD22x0, 2-channel). . . . . . . . . . . . . . . . . . . . 8
Connections diagram Flip Chip 12-bump (STCD23x0, 3-channel). . . . . . . . . . . . . . . . . . . . 9
Connections diagram Flip Chip 16-bump (STCD24x0, 4-channel). . . . . . . . . . . . . . . . . . . . 9
Jitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Typical application circuit using STCD24x0 for RF ends of TD-SCDMA/GSM dual-mode
mobile phone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Typical application circuit using STCD24x0 for baseband peripherals in mobile phone. . . 18
Quiescent current vs. supply voltage (EN1 = EN2 = EN3 = EN4 = 1,
no master clock input). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Quiescent current vs. temperature (EN1 = EN2 = EN3 = EN4 = 1,
C_load = 20 pF, no master clock input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Active current vs. temperature (EN1 = EN2 = EN3 = EN4 = 1, C_load = 20 pF,
V_CC = 3.8 V, f_MCLK = 26 MHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Standby current vs. supply voltage (EN1 = EN2 = EN3 = EN4 = 0, no master clock input) 20
Active current vs. supply voltage (EN1 = EN2 = EN3 = EN4 = 1, f_MCLK = 26 MHz,
C_load = 20 pF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Active current vs. master clock input voltage level (EN1 = EN2 = EN3 = EN4 = 1,
f_MCLK = 26 MHz, C_load = 20 pF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Active current vs. master clock frequency (EN1 = EN2 = EN3 = EN4 = 1, C_load = 20 pF) . 21
STCD2400 recovery time from standby to active (VTCXO is on) . . . . . . . . . . . . . . . . . . . . 22
STCD2400 recovery time from off to on (VTCXO first in standby) . . . . . . . . . . . . . . . . . . . 22
Output clock rise/fall time (C_load = 40 pF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
STCD2400 power-up sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
STCD2400 power-down sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Phase noise input (from the clock source, 26 MHz square wave XO KC2520C26 from
Kyocera) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Phase noise output (include the clock source and STCD2400 additive phase noise) . . . . 26
Flip Chip 12-bump, package mechanical outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Flip Chip 16-bump, package mechanical outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Flip Chip 12-bump tape and reel specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Flip Chip 16-bump tape and reel specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
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Doc ID 15400 Rev 2