M36L0R7060U1 Datasheet, PDF (20/22 Pages) STMicroelectronics – 128 Mbit (Mux I/O, Multiple Bank, Multi-Level, Burst) Flash memory, 32 or 64 Mbit PSRAM, 1.8V supply Multi-Chip Package

Part numbering
M36L0R7060U1, M36L0R7060L1, M36L0R7050U1, M36L0R7050L1
7
Part numbering
Note:
20/22
Table 7. Part numbering scheme
Example:
M36 L 0 R 7 0 5 0 L 1 ZAM F
Device Type
M36 = Multi-Chip Package (Flash + RAM)
Flash 1 Architecture
L = Multi-Level, Multiple Bank, Burst Mode
Flash 2 Architecture
0 = No Die
Operating Voltage
R = V_DDF = V_DDP = V_DDQF = 1.7V to 1.95V
Flash 1 Density
7 = 128 Mbit
Flash 2 Density
0 = No Die
RAM 1 Density
5 = 32 Mbit
6 = 64 Mbit
RAM 2 Density
0 = No Die
Parameter Block Location
U = Top Boot Block Flash
L = Bottom Boot Block Flash
Product Version
1 = 0.13µm Flash technology and multilevel design, 85ns speeds;
RAM, 70ns speed Mux I/O
Package
ZAM = Stacked TFBGA88 8x10mm - 8x10 active ball array, 0.8mm pitch
Packing Option
E = ECOPACK® Package, Standard Packing
F = ECOPACK® Package, Tape & Reel Packing
Devices are shipped from the factory with the memory content bits, in valid blocks, erased to
’1’. For further information on any aspect of this device, please contact your nearest ST
Sales Office.