TDA7500A Datasheet, PDF (2/40 Pages) STMicroelectronics – DIGITAL AM/FM SIGNAL PROCESSOR

TDA7500A
DESCRIPTION (continued)
An I²C/SPI interface is implemented for control and communication with the main micro. A separate SPI is avail-
able to interface the display micro.The DSP cores are integrated with their associated data and program mem-
ories. The peripherals and interfaces I²C, SPI, Serial Audio Interface (SAI), PLL Oscillator, External Memory
Interface, (EMI), General Purpose I/O register (Port A) and the D/A registers are connected to and controlled by
DSP0, whereas the A/D registers, the SPDIF and the General Purpose I/O register (Port B) are connected to
and controlled by DSP1. An hardware RDS filter , demodulator and decoder block is also embedded. No support
is needed from the DSPs but at initialisation so that RDS can work in background and in parallel with other DSP
processing. Separated Debug and Test Interfaces are connected to both DSP cores.
The TDA7500A is supposed to be used in kit with the TDA7501 or any other device of the same family. Thanks
to the serial audio interface also digital sources can be processed and a direct output to a digital bus is also
available.
The flexibility allowed by the wide memory space and by the two powerfull DSP cores make the TDA7500A us-
able for different applications. In example, inside the main radio as an audio co-processor or to perform the sig-
nal processing and equalisation associated to a digital power amplifier.
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
V_DD
Power supplies
V_CC
Digital
-0.5 to +4.6
V
Analog
-0.5 to +4.6
V
V_aio
Analog Input and Output Voltage
-0.5 to (V_CC+0.5)
V
V_dio
Digital Input and Output Voltage
-0.5 to (V_DD+0.5)
V
V_di5
Digital Input Voltage (5V tolerant)
-0.5 to 6.5
V
T_j
Operating Junction Temperature Range
-40 to 125
°C
T_stg
Storage Temperature
-55 to 150
°C
Warning: Operation at or beyond these limit may result in permanent damage to the device. Normal operation is not guaranteed at these
extremes.
THERMAL DATA
Symbol
Parameter
R_{th j-amb Thermal resistance junction to ambient} (1)
Thermal resistance junction to ambient ⁽²⁾
R_{th j-case Thermal junction to case} ⁽³⁾
Note: 1. In still air
2. On 4 layers board with soldered slug
3. Measured on top side of the package
Value
45
20
5
Unit
°C/W
°C/W
°C/W
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