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ST10F280 Datasheet, PDF (132/186 Pages) STMicroelectronics – 16-BIT MCU WITH MAC UNIT, 512K BYTE FLASH MEMORY AND 18K BYTE RAM
ST10F280
When enabled, the open drain of the RSTIN pin is
activated, pulling down the reset signal, for the
duration of the internal reset sequence
(synchronous/asynchronous hardware, software
and watchdog timer resets). At the end of the
internal reset sequence the pull down is released
and the RSTIN pin is sampled 8 TCL periods later.
– If signal is sampled low, a hardware reset is trig-
gered again.
– If it is sampled high, the chip exits reset state ac-
cording to the running reset way (synchronous/
asynchronous hardware, software and watch-
dog timer resets ).
Note: The bidirectional reset function is disabled
by any reset sequence (Bit BDRSTEN of
SYSCON is cleared). To be activated again it must
be enabled during the initialization routine.
17.6 - Reset Circuitry
The internal reset circuitry is described in Figure
68.
An internal pull-up resistor is implemented on
RSTIN pin. (50kΩ minimum, to 250kΩ maximum).
The minimum reset time must be calculated using
the lowest value. In addition, a programmable
pull-down (bit BDRSTEN of SYSCON register)
drives the RSTIN pin according to the internal
reset state as explained in Section 17.5 -
RSTOUT Pin and Bidirectional Reset.
The RSTOUT pin provides a signals to the
application as described in Section 17.5 -
RSTOUT Pin and Bidirectional Reset.
A weak internal pull-down is connected to the
RPD pin to discharge external capacitor to Vss at
a rate of 100µA to 200µA. This Pull-down is
turned on when RSTIN pin is low
If bit PWDCFG of SYSCON register is set, an
internal pull-up resistor is activated at the end of
the reset sequence. This pull-up charges the
capacitor connected to RPD pin.
If Bidirectional Reset function is not used, the
simplest way to reset ST10F280 is to connect
external components as shown in Figure 69. It
works with reset from application (hardware or
manual) and with power-on. The value of C1
capacitor, connected on RSTIN pin with internal
pull-up resistor (50kΩ to 250kΩ), must lead to a
charging time long enough to let the internal or
external oscillator and / or the on-chip PLL to
stabilize.
The R0-C0 components on RPD pin are mainly
implemented to provide a time delay to exit Power
down mode (see Chapter 18 - Power Reduction
Modes). Nervertheless, they drive RPD pin level
during resets and they lead to different reset
modes as explained hereafter. On power-on, C0
is totaly discharged, a low level on RPD pin forces
an asynchronous hardware reset. C0 capacitor
starts to charge throught R0 and at the end of
reset sequence ST10F280 restarts. RPD pin
threshold is typically 2.5V.
Depending on the delay of the next applied reset,
the MCU can enter a synchronous reset or an
asynchronous reset. If RPD pin is below 2.5V an
asynchronous reset starts, if RPD pin is above
2.5V a synchronous reset starts. (see Section
17.1 - Asynchronous Reset (Long Hardware
Reset) and Section 17.2 - Synchronous Reset
(Warm Reset)).
Note that an internal pull-down is connected to
RPD pin and can drive a 100µA to 200µA current.
This Pull-down is turned on when RSTIN pin is
low.
In order to properly use the Bidirectional reset
features, the schematic (or equivalent) of Figure
70 must be implemented. R1-C1 only work for
power-on or manual reset in the same way as
explained previously. D1 diode brings a faster
discharge of C1 capacitor at power-off during
repetitive switch-on / switch-off sequences. D2
diode performs an OR-wired connection, it can be
replaced with an open drain buffer. R2 resistor
may be added to increase the pull-up current to
the open drain in order to get a faster rise time on
RSTIN pin when bidirectional function is activated.
The start-up configurations and some system
features are selected on reset sequences as
described in Table 33 and Table 34.
Table 33 describes what is the system
configuration latched on PORT0 in the five
different reset ways. Table 34 summarizes the bit
state of PORT0 latched in RP0H, SYSCON,
BUSCON0 registers. RPOH register is described
in Section 19.2 - System Configuration Registers.
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