S71WS512NE0BFWZZ Datasheet, PDF (9/142 Pages) SPANSION – Stacked Multi-Chip Product (MCP) Flash Memory and pSRAM CMOS 1.8 Volt

Advance Information
Logic Symbol
23
A22–A0
A23
CE#f
CE1#pS
CE2s
16
DQ15–DQ0
OE#
RDY
WE#
WP#/ACC
RESET#
UB#
LB#
„ NOR Flash and pSRAM and DATA STORAGE densities up to 4 Gigabits
The signal locations of the resultant MCP device are shown above. Note that for different densities, the actual package
outline may vary. Any pinout in any MCP, however, will be a subset of the pinout above.
In some cases, there may be outrigger balls in locations outside the grid shown above. In such cases, the user is rec-
ommended to treat them as reserved and not connect them to any other signal.
For any further inquiries about the above look-ahead pinout, please refer to the ap-
plication note on this subject or contact your sales office.
June 28, 2004 S71WS512NE0BFWZZ_00_A1
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