S71WS512NE0BFWZZ Datasheet, PDF (1/142 Pages) SPANSION – Stacked Multi-Chip Product (MCP) Flash Memory and pSRAM CMOS 1.8 Volt

S71WS512NE0BFWZZ
Stacked Multi-Chip Product (MCP) Flash Memory
and pSRAM CMOS 1.8 Volt,
Simultaneous Operation, Burst Mode Flash Memory
and Pseudo-Static RAM
DISTINCTIVE CHARACTERISTICS
MCP Features
„ Operating Voltage Range of 1.65 to 1.95 V
„ High Performance
— Speed: 54MHz
„ Packages
— 96-ball FBGA—9 x 12 mm
„ Operating Temperatures
— Wireless: –25°C to +85°C
ADVANCE
INFORMATION
GENERAL DESCRIPTION
The S71WS512 Series is a product line of stacked Multi-Chip
Products (MCP) and consists of
„ One or more S29WS256N
(Simultaneous Operation, Burst Mode) Flash Die
„ pSRAM options
— 128Mb pSRAM
The products covered by this document are listed below. For
details about their specifications, please refer to the individual
constituent data sheets for further details.
MCP
S71WS512NE0
Number of S29WSxxxN
2
Total Flash Density
512Mb
pSRAM Density
256Mb
Notes:
1. This MCP is only guaranteed to operate @ 1.65 - 1.95 V regardless of component operating ranges.
Publication Number S71WS512NE0BFWZZ_00 Revision A Amendment 1 Issue Date June 28, 2004