LAN8187_06 Datasheet, PDF (72/72 Pages) SMSC Corporation – ±15kV ESD Protected MII/RMII Fast-Ethernet PHY with HP Auto-MDIX and SMSC flexPWRTM

±15kV ESD Protected MII/RMII Fast-Ethernet PHY with HP Auto-MDIX and SMSC flexPWR^TM
Datasheet
Chapter 9 Package Outline
Figure 9.1 64 Pin TQFP Package Outline, 10X10X1.4 Body, 12x12 mm Footprint
Table 9.1 64 Pin TQFP Package Parameters
MIN
NOMINAL
MAX
A
~
~
1.60
A1
0.05
~
0.15
A2
1.35
~
1.45
D
11.80
~
12.20
D1
9.80
~
10.20
E
11.80
~
12.20
E1
9.80
~
10.20
H
0.09
~
0.20
L
0.45
0.60
0.75
L1
~
1.00
~
e
0.50 Basic
θ
0^o
~
7^o
W
0.17
0.22
0.27
R
0.08
~
~
R2
0.08
~
0.20
ccc
~
~
0.08
REMARKS
Overall Package Height
Standoff
Body Thickness
X Span
X body Size
Y Span
Y body Size
Lead Frame Thickness
Lead Foot Length
Lead Length
Lead Pitch
Lead Foot Angle
Lead Width
Lead Shoulder Radius
Lead Foot Radius
Coplanarity
Notes:
1. Controlling Unit: millimeter.
2. Tolerance on the true position of the leads is ± 0.04 mm maximum.
3. Package body dimensions D1 and E1 do not include the mold protrusion.
Maximum mold protrusion is 0.25 mm per side.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.
SMSC LAN8187/LAN8187I
72
DATASHEET
Revision 1.0 (12-14-06)