LAN8187_06 Datasheet, PDF (63/72 Pages) SMSC Corporation – ±15kV ESD Protected MII/RMII Fast-Ethernet PHY with HP Auto-MDIX and SMSC flexPWRTM

±15kV ESD Protected MII/RMII Fast-Ethernet PHY with HP Auto-MDIX and SMSC flexPWR^TM
Datasheet
Chapter 7 DC Electrical Characteristics
7.1
DC Characteristics
7.1.1 Maximum Guaranteed Ratings
Stresses beyond those listed in Table 7.1may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Table 7.1 Maximum Conditions.
Parameter
Conditions
MIN
VDD33,VDDIO ^{Power pins to all other pins. -0.5}
To VSS ground
-0.5
Digital IO
VSS
VSS to all other pins
-0.5
MA UNIT
TYP
X
S
+3.6 V
Comment
+3.6 V
+4.0 V
Table 7.5, “MII Bus
Interface Signals,” on
page 66
Operating
Temperature
LAN8187-JT
0
+70 C
Commercial temperature
parts.
Operating
Temperature
Storage
Temperature
LAN8187I-JT
-40
+85 C
Industrial temperature
parts.
-55
+15 C
0
Table 7.2 ESD and LATCH-UP Performance
Parameter
Conditions
MA UNIT
MIN TYP
X
S
ESD PERFORMANCE
All Pins
Human Body Model
All Pins
IED61000-4-2 Contact Discharge
All Pins
IEC61000-4-2 Air-gap Discharge
LATCH-UP PERFORMANCE
All Pins
EIA/JESD 78, Class II
+/-8 kV
+/-8 kV
+/- kV
15
100 mA
Comments
7.1.1.1
Human Body Model (HBM) Performance
HBM testing verifies the ability to withstand the ESD strikes like those that occur during handling and
manufacturing. The device must work normally after the stress has ended, meaning no latch-up on any
pins. All pins on the LAN8187 provide +/- 8kV HBM protection.
SMSC LAN8187/LAN8187I
63
DATASHEET
Revision 1.0 (12-14-06)