SI8605 Datasheet, PDF (39/40 Pages) Silicon Laboratories – BIDIRECTIONAL IC ISOLATORS WITH UNIDIRECTIONAL DIGITAL CHANNELS

Si860x
DOCUMENT CHANGE LIST
Revision 0.1 to Revision 0.2
 Si8601 replaced by Si8602 throughout.
 Added chip graphics on page 1.
 Moved Table 12 to page 14.
 Updated Table 3, “Si8600/02/05/06 Electrical
Characteristics for Bidirectional I2C Channels¹,” on
page 5.
 Updated Table 7, “Insulation and Safety-Related
Specifications,” on page 11.
 Updated Table 9, “IEC 60747-5-2 Insulation
Characteristics for Si86xxxx*,” on page 12.
 Moved “3. Typical Application Overview” to page 16.
 Moved “Typical Performance Characteristics” to
page 23.
 Updated "5.Pin Descriptions" on page 24.
 Updated "6.Ordering Guide" on page 27.
Revision 0.2 to Revision 0.3
 Added chip graphics on page 1.
 Moved Tables 1 and 2 to page 4.
 Updated Table 7, “Insulation and Safety-Related
Specifications,” on page 11.
 Updated Table 9, “IEC 60747-5-2 Insulation
Characteristics for Si86xxxx*,” on page 12.
 Moved Table 13 to page 17.
 Moved Table 14 to page 21.
 Updated "5.Pin Descriptions" on page 24.
 Updated "6.Ordering Guide" on page 27.
Revision 0.3 to Revision 1.0
 Reordered spec tables to conform to new
convention.
 Removed “pending” throughout document.
Revision 1.0 to Revision 1.1
 Updated Figures 12 and 13.
Updated Pin 7 AGND connection.
 Updated "6.Ordering Guide" on page 27 to include
MSL2A.
Revision 1.1 to Revision 1.2
 Updated Table 12 on page 14.
Added junction temperature spec.
 Updated "4.4.1.Supply Bypass" on page 22.
 Updated "6.Ordering Guide" on page 27.
Removed Rev A devices.
 Updated "7.Package Outline: 16-Pin Wide Body
SOIC" on page 28.
 Updated Top Marks.
Added revision description.
Revision 1.2 to Revision 1.3
 Added Figure 3, “Common Mode Transient Immunity
Test Circuit,” on page 9.
 Added references to CQC throughout.
 Added references to 2.5 kV_RMS devices throughout.
 Removed Fail-safe operating mode throughout.
 Updated "6.Ordering Guide" on page 27.
 Updated "13.1.Si860x Top Marking (16-Pin Wide
Body SOIC)" on page 36.
Revision 1.3 to Revision 1.4
 Updated Table 6 on page 10.
Added CQC certificate numbers.
 Corrected Device Power Dissipation units in
Table 10 on page 12.
 Updated "6.Ordering Guide" on page 27.
Removed references to moisture sensitivity levels.
Removed Note 2.
Rev. 1.4
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