SI510-11 Datasheet, PDF (23/26 Pages) Silicon Laboratories – 2 to 4 week lead times

Si510/511
12. PCB Land Pattern: 3.2 x 5.0 mm, 6-pin
Figure 11 illustrates the 3.2 x 5.0 mm PCB land pattern for the Si510/511. Table 21 lists the values for the
dimensions shown in the illustration.
Figure 11. Si510/511 Recommended PCB Land Pattern
Table 21. PCB Land Pattern Dimensions (mm)
Dimension
C1
E
X1
Y1
(mm)
2.60
1.27
0.80
1.70
Notes:
General
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
4. All dimensions shown are at Maximum Material Condition (MMC). Least Material
Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm.
Solder Mask Design
5. All metal pads are to be non-solder mask defined (NSMD). Clearance between the
solder mask and the metal pad is to be 60 µm minimum, all the way around the pad.
Stencil Design
6. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be
used to assure good solder paste release.
7. The stencil thickness should be 0.125 mm (5 mils).
8. The ratio of stencil aperture to land pad size should be 1:1.
Card Assembly
9. A No-Clean, Type-3 solder paste is recommended.
10. The recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification
for Small Body Components.
Rev. 1.2
23