SI823X Datasheet, PDF (22/52 Pages) Silicon Laboratories – 0.5 AND 4.0 AMP ISODRIVERS (2.5 AND 5 KVRMS)

Si823x
5.3. Power Supply Connections
Isolation requirements mandate individual supplies for VDDI, VDDA, and VDDB. The decoupling caps for these
supplies must be placed as close to the VDD and GND pins of the Si823x as possible. The optimum values for
these capacitors depend on load current and the distance between the chip and the regulator that powers it. Low
effective series resistance (ESR) capacitors, such as Tantalum, are recommended.
5.4. Power Dissipation Considerations
Proper system design must assure that the Si823x operates within safe thermal limits across the entire load range.
The Si823x total power dissipation is the sum of the power dissipated by bias supply current, internal switching
losses, and power delivered to the load. Equation 1 shows total Si823x power dissipation. In a non-overlapping
system, such as a high-side/low-side driver, n = 1. For a dual driver with each driver having an independent load, n
can have a maximum value of 2, corresponding to a 100% overlap between the two outputs.
P_D = V_DDII_DDI + 2V_DDOI_QOUT + C_intV_DDO2F + 2nC_LV_DDO2F
where:
P_D is the total Si823x device power dissipation (W)
I_DDI is the input-side maximum bias current (3 mA)
I_QOUT is the driver die maximum bias current (2.5 mA)
C_int is the internal parasitic capacitance (75 pF for the 0.5 A driver and 370 pF for the 4.0 A driver)
V_DDI is the input-side VDD supply voltage (4.5 to 5.5 V)
V_DDO is the driver-side supply voltage (10 to 24 V)
F is the switching frequency (Hz)
n is the overlap constant (max value = 2)
Equation 1.
The maximum power dissipation allowable for the Si823x is a function of the package thermal resistance, ambient
temperature, and maximum allowable junction temperature, as shown in Equation 2:
P_Dmax

-^T---^j--^m----^a---^x----–----^T----^A--
ja
where:
P_Dmax = Maximum Si823x power dissipation (W)
T_jmax = Si823x maximum junction temperature (145 °C)
T_A = Ambient temperature (°C)
ja = Si823x junction-to-air thermal resistance (105 °C/W)
F = Si823x switching frequency (Hz)
Equation 2.
Substituting values for PDMAX TjMAX, TA, and _ja into Equation 2 results in a maximum allowable total power
dissipation of 1.1 W. Maximum allowable load is found by substituting this limit and the appropriate datasheet
values from Table 1 on page 6 into Equation 1 and simplifying. The result is Equation 3 (0.5 A driver) and
Equation 4 (4.0 A driver), both of which assume VDDI = 5 V and VDDA = VDDB = 18 V.
C_L(MAX)
=
1_----._--4_----_-----1_---0_----^–_---³_-
F
–
7.5

10^–11
Equation 3.
C_L(MAX)
=
1_----._--4_----_-----1_---0_----^–_---³_-
F
–
3.7

10^–10
Equation 4.
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Rev. 0.3