SI512-13 Datasheet, PDF (10/20 Pages) Silicon Laboratories – Two selectable output frequencies

Si512/513
Table 8. Environmental Compliance and Package Information
Parameter
Mechanical Shock
Mechanical Vibration
Solderability
Gross and Fine Leak
Resistance to Solder Heat
Moisture Sensitivity Level
Contact Pads
Conditions/Test Method
MIL-STD-883, Method 2002
MIL-STD-883, Method 2007
MIL-STD-883, Method 2003
MIL-STD-883, Method 1014
MIL-STD-883, Method 2036
MSL 1
Gold over Nickel
Table 9. Thermal Characteristics
Parameter
Thermal Resistance Junction to Ambient
Symbol
_JA
Test Condition
Still air
Value
110
Units
°C/W
Table 10. Absolute Maximum Ratings¹
Parameter
Symbol
Rating
Units
Maximum Operating Temperature
Storage Temperature
Supply Voltage
Input Voltage (any input pin)
ESD Sensitivity (HBM, per JESD22-A114)
Soldering Temperature (Pb-free profile)²
Soldering Temperature Time at T_PEAK (Pb-free profile)²
T_AMAX
T_S
V_DD
V_I
HBM
T_PEAK
T_P
85
o_C
–55 to +125
o_C
–0.5 to +3.8
V
–0.5 to V_DD + 0.3
V
2
kV
260
o_C
20–40
sec
Notes:
1. Stresses beyond those listed in this table may cause permanent damage to the device. Functional operation or
specification compliance is not implied at these conditions. Exposure to maximum rating conditions for extended
periods may affect device reliability.
2. The device is compliant with JEDEC J-STD-020C.
10
Rev. 1.0