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HYB3164165T Datasheet, PDF (29/30 Pages) Siemens Semiconductor Group – 4M x 16-Bit Dynamic RAM
Package Outlines
P-TSOPII-54-1 (500 mil)
(Plastic Thin Small Outline Package Type II
HYB3164(5)165T(L)-50/-60
4M x 16 EDO-DRAM
Sorts of Packing
Package outlines for tubes, trays etc. are contained in our
Data Book “Package Information”.
SMD = Surface Mounted Device
Semiconductor Group
59
Dimensions in mm