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K4H560438E-UC Datasheet, PDF (16/23 Pages) Samsung semiconductor – 256Mb E-die DDR SDRAM Specification 66 TSOP-II with Pb-Free (RoHS compliant)
DDR SDRAM 256Mb E-die (x4, x8) Pb-Free
DDR SDRAM
Parameter
Mode register set cycle time
DQ & DM setup time to DQS
DQ & DM hold time to DQS
Control & Address input pulse width
DQ & DM input pulse width
Power down exit time
Exit self refresh to non-Read command
Exit self refresh to read command
Refresh interval time
Output DQS valid window
Clock half period
Data hold skew factor
DQS write postamble time
Active to Read with Auto precharge
command
Autoprecharge write recovery +
Precharge time
Symbol
B3
(DDR333@CL=2.5))
Min Max
AA
(DDR266@CL=2.0)
Min Max
A2
(DDR266@CL=2.0)
Min Max
B0
(DDR266@CL=2.5))
Min Max
tMRD
12
15
15
15
tDS
0.45
0.5
0.5
0.5
tDH
0.45
0.5
0.5
0.5
tIPW
2.2
2.2
2.2
2.2
tDIPW 1.75
1.75
1.75
1.75
tPDEX
6
7.5
7.5
7.5
tXSNR
75
75
75
75
tXSRD 200
200
200
200
tREFI
7.8
7.8
7.8
7.8
tQH
tHP
-tQHS
-
tHP
-tQHS
-
tHP
-tQHS
-
tHP
-tQHS
-
tHP
tCLmin
or tCHmin
-
tCLmin
or tCHmin
-
tCLmin
or tCHmin
-
tCLmin
or tCHmin
-
tQHS
0.55
0.75
0.75
0.75
tWPST
0.4
0.6
0.4
0.6
0.4
0.6
0.4
0.6
tRAP
18
20
20
20
tDAL
(tWR/tCK)
+
(tRP/tCK)
(tWR/tCK)
+
(tRP/tCK)
(tWR/tCK)
+
(tRP/tCK)
(tWR/tCK)
+
(tRP/tCK)
Unit Note
ns
ns j, k
ns j, k
ns
8
ns 8
ns
ns
tCK
us 4
ns 11
ns 10, 11
ns 11
tCK 2
tCK 13
System Characteristics for DDR SDRAM
The following specification parameters are required in systems using DDR333, DDR266 & DDR200 devices to ensure
proper system performance. these characteristics are for system simulation purposes and are guaranteed by design.
Table 1 : Input Slew Rate for DQ, DQS, and DM
AC CHARACTERISTICS
PARAMETER
SYMBOL
DQ/DM/DQS input slew rate measured between
VIH(DC), VIL(DC) and VIL(DC), VIH(DC)
DCSLEW
DDR333
MIN
MAX
TBD
TBD
DDR266
MIN
MAX
TBD
TBD
DDR200
MIN
MAX
0.5
4.0
Units
V/ns
Notes
a, m
Table 2 : Input Setup & Hold Time Derating for Slew Rate
Input Slew Rate
tIS
tIH
Units
0.5 V/ns
0
0
ps
0.4 V/ns
+50
0
ps
0.3 V/ns
+100
0
ps
Notes
i
i
i
Table 3 : Input/Output Setup & Hold Time Derating for Slew Rate
Input Slew Rate
tDS
tDH
Units
0.5 V/ns
0
0
ps
0.4 V/ns
+75
+75
ps
0.3 V/ns
+150
+150
ps
Notes
k
k
k
Rev. 1.1 October, 2004