NE5550279A Datasheet, PDF (7/9 Pages) Renesas Technology Corp – Silicon Power LDMOS FET

NE5550279A
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
Wave Soldering
Partial Heating
Soldering Conditions
Peak temperature (package surface temperature) : 260°C or below
Time at peak temperature
: 10 seconds or less
Time at temperature of 220°C or higher
: 60 seconds or less
Preheating time at 120 to 180°C
: 120±30 seconds
Maximum number of reflow processes
: 3 times
Maximum chlorine content of rosin flux (% mass) : 0.2% (Wt.) or below
Peak temperature (molten solder temperature)
Time at peak temperature
: 260°C or below
: 10 seconds or less
Preheating temperature (package surface temperature)
: 120°C or below
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass) : 0.2% (Wt.) or below
Peak temperature (terminal temperature)
Soldering time (per side of device)
: 350°C or below
: 3 seconds or less
Maximum chlorine content of rosin flux (% mass) : 0.2% (Wt.) or below
Condition Symbol
IR260
WS260
HS350
CAUTION
Do not use different soldering methods together (except for partial heating).
R09DS0033EJ0100 Rev.1.00
Mar 28, 2012
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