TLC5944 Datasheet, PDF (3/34 Pages) Texas Instruments – 16-Channel, 12-Bit PWM LED Driver with 6-Bit Dot Correction and Pre-Charge FET

TLC5944
www.ti.com ...................................................................................................................................................................................................... SBVS112 – JUNE 2008
RECOMMENDED OPERATING CONDITIONS
At T_A= –40°C to +85°C, unless otherwise noted.
PARAMETER
DC Characteristics: V_CC = 3 V to 5.5 V
V_CC
Supply voltage
V_UP
Pre-charge voltage
V_O
Voltage applied to output
V_IH
High-level input voltage
V_IL
Low-level input voltage
I_OH
High-level output current
I_OL
Low-level output current
I_OLC
Constant output sink current
T_A
Operating free-air temperature
T_J
Operating junction
temperature
AC Characteristics: V_CC = 3 V to 5.5 V
f_{CLK (sclk)}
Data shift clock frequency
f_{CLK (gsclk)}
Grayscale control clock
frequency
T_WH0/T_WL0
T_WH1
T_SU0
T_SU1
T_SU2
T_SU3
Pulse duration
Setup time
T_SU4
T_SU5
T_H0
T_H1
T_H2
T_H3
Hold time
TEST CONDITIONS
OUT0 to OUT15
SOUT
SOUT
XERR
OUT0 to OUT15
SCLK
GSCLK
SCLK, GSCLK
XLAT, BLANK
SIN–SCLK↑
BLANK↓–GSCLK↑
XLAT↑–SCLK↑
XLAT↓–SCLK↑
(for SID reading only)
DCSEL–SCLK↑
DCSEL–XLAT↑
SIN–SCLK↑
XLAT↑–SCLK↑
DCSEL–SCLK↓
DCSEL–XLAT↑
TLC5944
MIN
NOM
MAX UNIT
3.0
3.0
0.7 × V_CC
GND
–40
–40
5.5
V
15
V
V_UP
V
V_CC
V
0.3 × V_CC
V
–1 mA
1 mA
5 mA
60 mA
+85
°C
+125
°C
30 MHz
33 MHz
10
ns
15
ns
5
ns
15
ns
100
ns
20
ns
10
ns
10
ns
3
ns
10
ns
10
ns
100
ns
DISSIPATION RATINGS
PACKAGE
HTSSOP-28 with
PowerPAD soldered⁽¹⁾
HTSSOP-28 with
PowerPAD not soldered⁽²⁾
QFN-32 ⁽³⁾
OPERATING FACTOR
ABOVE T_A = +25°C
31.67 mW/°C
16.21 mW/°C
27.86 mW/°C
T_A < +25°C
POWER RATING
3958 mW
2026 mW
3482 mW
T_A = +70°C
POWER RATING
2533 mW
1296 mW
2228 mW
T_A = +85°C
POWER RATING
2058 mW
1053 mW
1811 mW
(1) With PowerPAD soldered onto copper area on printed circuit board (PCB); 2-oz. copper. For more information, see SLMA002 (available
for download at www.ti.com).
(2) With PowerPAD not soldered onto copper area on PCB.
(3) The package thermal impedance is calculated in accordance with JESD51-5.
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TLC5944
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