HYS72T256322HP Datasheet, PDF (4/36 Pages) Qimonda AG – 240-Pin Dual-Die Registered DDR2 SDRAM Modules

Internet Data Sheet
HYS72T256322HP–[3S/3.7]–A
Registered DDR2 SDRAM Modules
1.2
Description
The Qimonda HYS72T256322HP–[3S/3.7]–A module family
are Very Low Profile (VLP) Registered Dual-Die DIMM
(RDIMM with parity) with 18.30 mm height based on DDR2
technology. DIMMs are available as ECC modules in
256M x 72 (2 GByte) organization and density, intended for
mounting into 240-Pin connector sockets.
The memory array is designed with 512-Mbit Double-Data-
Rate-Two (DDR2) Synchronous DRAMs. All control and
address signals are re-driven on the DIMM using register
devices and a PLL for the clock distribution. This reduces
capacitive loading to the system bus, but adds one cycle to
the SDRAM timing. Decoupling capacitors are mounted on
the PCB board. The DIMMs feature serial presence detect
based on a serial E²PROM device using the 2-pin I²C
protocol. The first 128 bytes are programmed with
configuration data and the second 128 bytes are available to
the customer.
Product Type¹⁾
Compliance Code²⁾
TABLE 2
Ordering Information for RoHS Compliant Products
Description SDRAM Technology
PC2-5300
HYS72T256322HP–3S–A
2 GB 2R×4 PC2–5300P–555–12–W0
2 Ranks, ECC 512 Mbit (×4)
PC2-4200
HYS72T256322HP–3.7–A
2 GB 2R×4 PC2–4200P–444–12–W0
2 Ranks, ECC 512 Mbit (×4)
1) All part numbers end with a place code, designating the silicon die revision. Example: HYS72T256322HP–3.7–A, indicating Rev. “A” dies
are used for DDR2 SDRAM components. For all Qimonda DDR2 module and component nomenclature see Chapter 6 of this data sheet.
2) The Compliance Code is printed on the module label and describes the speed grade, for example “PC2–4200P–444–12–W0”, where
4200P means Registered Parity DIMM modules with 4.26 GB/sec Module Bandwidth and “444-12” means Column Address Strobe (CAS)
latency = 4, Row Column Delay (RCD) latency = 4 and Row Precharge (RP) latency = 4 using the latest JEDEC SPD Revision 1.2 and
produced on the Raw Card “W”
DIMM
Density
2 GB
Module
Organization
256M × 72
Memory
Ranks
2
ECC/
Non-ECC
ECC
# of
SDRAMs
18
TABLE 3
Address Format
# of row/bank/columns bits Raw Card
14/2/11
W
Product Type¹⁾
DRAM Components¹⁾
DRAM Density
TABLE 4
Components on Modules
DRAM Organization
Note²⁾
HYS72T256322HP
HYB18T1G402AF
512 Mbit
2 x 128M × 4
1) Green Product
2) For a detailed description of all available functions of the DRAM components on these modules see the component data sheet.
Rev. 1.01, 2006-09
4
03062006-PK3L-ZYSE