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HYS72T256322HP Datasheet, PDF (23/36 Pages) Qimonda AG – 240-Pin Dual-Die Registered DDR2 SDRAM Modules
Internet Data Sheet
HYS72T256322HP–[3S/3.7]–A
Registered DDR2 SDRAM Modules
13) The tHZ, tRPST and tLZ, tRPRE parameters are referenced to a specific voltage level, which specify when the device output is no longer driving
(tHZ, tRPST), or begins driving (tLZ, tRPRE). tHZ and tLZ transitions occur in the same access time windows as valid data transitions.These
parameters are verified by design and characterization, but not subject to production test.
14) The Auto-Refresh command interval has be reduced to 3.9 µs when operating the DDR2 DRAM in a temperature range between 85 °C
and 95 °C.
15) 0 °C≤ TCASE ≤ 85 °C
16) 85 °C < TCASE ≤ 95 °C
17) A maximum of eight Auto-Refresh commands can be posted to any given DDR2 SDRAM device.
18) The tRRD timing parameter depends on the page size of the DRAM organization. See Table 2 “Ordering Information for RoHS
Compliant Products” on Page 4.
19) The maximum limit for the tWPST parameter is not a device limit. The device operates with a greater value for this parameter, but system
performance (bus turnaround) degrades accordingly.
20) WR must be programmed to fulfill the minimum requirement for the tWR timing parameter, where WRMIN[cycles] = tWR(ns)/tCK(ns) rounded
up to the next integer value. tDAL = WR + (tRP/tCK). For each of the terms, if not already an integer, round to the next highest integer. tCK
refers to the application clock period. WR refers to the WR parameter stored in the MRS.
21) Minimum tWTR is two clocks when operating the DDR2-SDRAM at frequencies ≤ 200 ΜΗz.
22) User can choose two different active power-down modes for additional power saving via MRS address bit A12. In “standard active power-
down mode” (MR, A12 = “0”) a fast power-down exit timing tXARD can be used. In “low active power-down mode” (MR, A12 =”1”) a slow
power-down exit timing tXARDS has to be satisfied.
3.3.3
ODT AC Electrical Characteristics
This chapter contains the ODT AC electrical characteristics tables.
Symbol Parameter / Condition
TABLE 16
ODT AC Characteristics and Operating Conditions for DDR2-667
Values
Unit
Note
Min.
Max.
tAOND
ODT turn-on delay
2
2
tCK
tAON
ODT turn-on
tAC.MIN
tAC.MAX + 0.7 ns
ns
1)
tAONPD
ODT turn-on (Power-Down Modes)
tAC.MIN + 2 ns 2 tCK + tAC.MAX + 1 ns
ns
tAOFD
tAOF
ODT turn-off delay
ODT turn-off
2.5
tAC.MIN
2.5
tAC.MAX + 0.6 ns
tCK
ns
2)
tAOFPD
ODT turn-off (Power-Down Modes)
tAC.MIN + 2 ns 2.5 tCK + tAC.MAX + 1 ns ns
tANPD
ODT to Power Down Mode Entry Latency
3
—
tCK
tAXPD
ODT Power Down Exit Latency
8
—
tCK
1) ODT turn on time min. is when the device leaves high impedance and ODT resistance begins to turn on. ODT turn on time max is when
the ODT resistance is fully on. Both are measure from tAOND.
2) ODT turn off time min. is when the device starts to turn off ODT resistance. ODT turn off time max is when the bus is in high impedance.
Both are measured from tAOFD.
Rev. 1.01, 2006-09
24
03062006-PK3L-ZYSE