HYB18H256321BF Datasheet, PDF (37/41 Pages) Qimonda AG – 256-Mbit GDDR3 Graphics RAM GDDR3 Graphics RAM

Internet Data Sheet
5.2
Package Thermal Characteristics
HYB18H256321BF
256-Mbit GDDR3
JEDEC Board
Air Flow
K/W
1s0p
0 m/s
40
1 m/s
32
3 m/s
27
Theta_jA
2s0p
0 m/s
22
TABLE 20
PG-TFBGA-136 Package Thermal Resistances
Theta_jB Theta_jC
1 m/s
3 m/s
-
-
19
17
5
2
Notes
1. Theta_jA: Junction to Ambient thermal resistance. The values have been obtained by simulation using the conditions stated
in the JEDEC JESD-51 standard.
2. Theta_jB: Junction to Board thermal resistance. The value has been obtained by simulation.
3. Theta_jC: Junction to Case thermal resistance. The value has been obtained by simulation.
Rev. 0.80, 2007-09
37
09132007-07EM-7OYI