HYS72T512420EFA Datasheet, PDF (16/37 Pages) Qimonda AG – 240-Pin Fully-Buffered DDR2 SDRAM Modules DDR2 SDRAM RoHS Compliant Products

Internet Data Sheet
HYS72T512420EFA–[25F/3S]–C
Fully-Buffered DDR2 SDRAM Modules
4
Electrical Characteristics
This chapter describes the electrical characteristics.
4.1
Operating Conditions
This chapter describes the operating conditions.
Parameter
Symbol
TABLE 8
Absolute Maximum Ratings
Rating
Unit Notes
Min. Max.
Voltage on any SMbus interface signal pin relative to V_SS
V_IN, V_OUT
–0.5 +4.00 V
1)
Voltage on V_DD pin relative to V_SS
V_DD
–0.5 +2.4
V
2)
Voltage on V_CC pin relative to V_SS
V_CC
–0,3 +1.75 V
–
Voltage on V_DDQ pin relative to V_SS
V_DDQ
–0.5 +2.3
V
2)3)
Voltage on V_DDL pin relative to V_SS
V_DDL
–0.5 +2.3
V
2)3)
Voltage on any pin relative to V_SS
V_IN, V_OUT
–0.3 +1.75 V
2)
Voltage on V_TT pin relative to V_SS
V_TT
–0.5 +2.3
V
–
Storage Temperature
T_STG
–55 +100
°C
2)3)
1) Stresses greater than those listed under “Absolute Maximum Ratings“ may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
2) When V_DD and V_DDQ and V_DDL are less than 500 mV; V_REF may be equal to or less than 300 mV.
3) Storage Temperature is the case surface temperature on the center/top side of the DRAM.
Attention: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to
the device. This is a stress rating only and functional operation of the device at these or any other
conditions above those indicated in the operational sections of this specification is not implied. Exposure
to absolute maximum rating conditions for extended periods may affect reliability.
Parameter
Symbol Values
TABLE 9
Operating Temperature Range
Unit Note
Min Max
Junction Temperature
T_J
0
DRAM Component Case Temperature Range T_CASE 0
AMB Component Case Temperature Range
0
115 °C ¹⁾²⁾
95
°C ³⁾⁴⁾
111 °C ¹⁾²⁾
1) Stresses greater than those listed under “Absolute Maximum Ratings“ may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
2) Within the DRAM Component Case temperature range all DRAM specifications will be supported.
Rev.1.20, 2007-10-19
16
03202007-06NE-DYYI