RB520CS3002L_15 Datasheet, PDF (9/13 Pages) NXP Semiconductors – 200 mA low VF MEGA Schottky barrier rectifier

NXP Semiconductors
RB520CS3002L
200 mA low VF MEGA Schottky barrier rectifier
12. Package outline
0.62
0.50
0.55
0.46
0.30
2
0.22
0.65
1.02
0.95
0.30
0.22
1
0.55
0.47
Dimensions in mm
Fig. 14. Package outline DFN1006-2 (SOD882)
cathode marking on top side (if applicable)
03-04-17
13. Soldering
1.3
0.7
R0.05 (8×)
0.9
0.6 0.7 0.8
(2×) (2×) (2×)
0.3
(2×)
0.4
(2×)
0.5
(2×)
Fig. 15. Reflow soldering footprint for DFN1006-2 (SOD882)
solder lands
solder resist
solder paste
occupied area
Dimensions in mm
sod882_fr
RB520CS3002L
Product data sheet
All information provided in this document is subject to legal disclaimers.
25 June 2013
© NXP B.V. 2013. All rights reserved
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