BUK6C3R3-75C_15 Datasheet, PDF (9/13 Pages) NXP Semiconductors – N-channel TrenchMOS intermediate level FET

NXP Semiconductors
BUK6C3R3-75C
N-channel TrenchMOS intermediate level FET
7. Package outline
Plastic single-ended surface-mounted package (D2PAK); 7 leads (one lead cropped)
SOT427
E
D1
D
HD
4
1
7
b
e e eee e
A
A1
mounting
base
Lp
c
Q
0
2.5 5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A
A1
b
c
D
max.
D1
E
e
mm
4.50
4.10
1.40
1.27
0.85
0.60
0.64
0.46
11
1.60
1.20
10.30
9.70
1.27
Lp HD
Q
2.90 15.80 2.60
2.10 14.80 2.20
OUTLINE
VERSION
IEC
SOT427
REFERENCES
JEDEC
JEITA
Fig 17. Package outline SOT427 (D2PAK)
EUROPEAN
PROJECTION
ISSUE DATE
05-03-09
06-03-16
BUK6C3R3-75C
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 18 January 2012
© NXP B.V. 2012. All rights reserved.
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