PHN603S Datasheet, PDF (6/7 Pages) NXP Semiconductors – TrenchMOS/ Schottky diode array Three phase brushless d.c. motor driver

Philips Semiconductors
TrenchMOS/ Schottky diode array
Three phase brushless d.c. motor driver
MECHANICAL DATA
SO24: plastic small outline package; 24 leads; body width 7.5 mm
Product specification
PHN603S
SOT137-1
D
y
Z
24
c
13
E
A
X
HE
vM A
pin 1 index
1
e
12
wM
bp
A2
A1
Q
(A 3)
A
θ
Lp
L
detail X
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D ⁽¹⁾ E ⁽¹⁾
e
HE
L
Lp
Q
v
w
y
Z ⁽¹⁾
θ
mm
2.65
0.30
0.10
2.45
2.25
0.25
0.49
0.36
0.32
0.23
15.6
15.2
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25 0.25
0.1
0.9
0.4
8^o
inches
0.10
0.012 0.096
0.004 0.089
0.01
0.019 0.013
0.014 0.009
0.61
0.60
0.30
0.29
0.050
0.419
0.394
0.055
0.043
0.016
0.043
0.039
0.01
0.01
0.004
0.035
0.016
0^o
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
OUTLINE
VERSION
SOT137-1
IEC
075E05
REFERENCES
JEDEC
EIAJ
MS-013AD
EUROPEAN
PROJECTION
ISSUE DATE
95-01-24
97-05-22
Fig.17. SOT137-1 (SO24) surface mounting package.
Notes
1. This product is supplied in anti-static packaging. The gate-source input must be protected against static
discharge during transport or handling.
2. Refer to Integrated Circuit Packages, Data Handbook IC26.
3. Epoxy meets UL94 V0 at 1/8".
October 1998
6
Rev 1.000