BUK221-50DY Datasheet, PDF (5/16 Pages) NXP Semiconductors – Dual channel high-side TOPFET

Philips Semiconductors
BUK221-50DY
Dual channel high-side TOPFET™
5. Limiting values
Table 4: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
V_BG
battery-ground supply voltage
[1]
I_L
load current
T_mb ≤ 130 °C
P_tot
total power dissipation
T_mb ≤ 25 °C
T_stg
storage temperature
T_j
junction temperature
T_mb
mounting base temperature
during soldering (≤ 10 s)
Reverse battery voltage
V_BGR
reverse battery-ground supply voltage R_I ≥ 3.3 kΩ; R_SS ≥ 3.3 kΩ; Figure 10
[2]
V_BGRR
repetitive reverse battery-ground
supply voltage
Input current
I_I
input current
I_IRM
repetitive peak input current
Status current
δ ≤ 0.1; t_p = 300 µs
I_S
status current
I_SRM
repetitive peak status current
Inductive load clamping
δ ≤ 0.1; t_p = 300 µs
E_BL(CL)S
non-repetitive battery-load clamping
energy
Electrostatic discharge voltage
T_j = 150 °C prior to turn-off; V_BG = 13 V;
I_L = 5 A; (one channel) Figure 13
V_esd
electrostatic discharge voltage
Human Body Model 1; C = 100 pF;
R = 1.5 kΩ
Min Max Unit
-
45 V
-
4
A
-
44.6 W
−55 +175 °C
−40 +150 °C
-
260 °C
-
16 V
-
32 V
−5 +5 mA
−50 +50 mA
−5 +5 mA
−50 +50 mA
-
60 mJ
-
2
kV
[1] The device will not be harmed by exposure to the maximum supply voltage, but normal operation is not possible because of overvoltage
shutdown - see Table 6 “Static characteristics” for the operating range.
[2] Reverse battery voltage is only allowed with external resistors to limit the input and status currents to a safe value. The connected load
must limit the reverse load current. The internal ground resistor limits the reverse battery ground current. See Figure 10 “Typical
dynamic response circuit diagram including reverse supply protection and open load detection.”
6. Thermal characteristics
Table 5:
Symbol
R_th(j-mb)
R_th(j-a)
Thermal characteristics
Parameter
thermal resistance from junction to
mounting base
thermal resistance from junction to
ambient
Conditions
per channel
both channels
mounted on printed circuit board;
minimum footprint
Min Typ Max Unit
-
4
5.6 K/W
-
2
2.8 K/W
-
50 -
K/W
9397 750 11167
Product data
Rev. 01 — 16 April 2003
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
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