BUK221-50DY Datasheet, PDF (13/16 Pages) NXP Semiconductors – Dual channel high-side TOPFET

Philips Semiconductors
9. Package outline
BUK221-50DY
Dual channel high-side TOPFET™
Plastic single-ended surface mounted package (Philips version of D²-PAK);
7 leads (one lead cropped)
SOT427
E
D1
D
HD
4
1
7
b
e e eee e
A
A1
mounting
base
Lp
c
Q
0
2.5 5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A
A1
b
c
D
max.
D1
E
e
mm ^{4.50 1.40 0.85 0.64}
4.10 1.27 0.60 0.46
11
1.60 10.30 _1.27
1.20 9.70
Lp
HD
Q
2.90 15.80 2.60
2.10 14.80 2.20
OUTLINE
VERSION
IEC
SOT427
REFERENCES
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
99-06-25
01-04-18
Epoxy meets UL94 V0 at 1/8’’. Net mass: 1.5g. For soldering guidelines and surface mount footprint design, please refer to
Data Handbook SC18.
Fig 15. SOT427 (D²-PAK).
9397 750 11167
Product data
Rev. 01 — 16 April 2003
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
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