BUK7215-55A Datasheet, PDF (4/12 Pages) NXP Semiconductors – TrenchMOS standard level FET

Philips Semiconductors
BUK7215-55A
TrenchMOS™ standard level FET
7. Thermal characteristics
Table 4:
Symbol
R_th(j-a)
R_th(j-mb)
Thermal characteristics
Parameter
Conditions
thermal resistance from junction to ambient minimum footprint, FR4 board
thermal resistance from junction to mounting Figure 4
base
7.1 Transient thermal impedance
Value Unit
71.4
K/W
1.3
K/W
10
Zth(j-mb)
(K/W)
1
10-1
10-2
δ = 0.5
0.2
0.1
0.05
0.02
Single Shot
10-3
10-6
10-5
10-4
10-3
10-2
03nf77
P
δ
=
tp
T
tp
t
T
10-1
tp (s)
1
Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration.
9397 750 08632
Product data
Rev. 01 — 16 August 2001
© Koninklijke Philips Electronics N.V. 2001. All rights reserved.
4 of 12