TDA8006 Datasheet, PDF (32/40 Pages) NXP Semiconductors – Multiprotocol IC Card coupler

Philips Semiconductors
Multiprotocol IC Card coupler
Product specification
TDA8006
SYMBOL
PARAMETER
CONDITIONS
MIN. TYP. MAX. UNIT
Card presence input (pin PRES)
V_IL
LOW-level input voltage
V_IH
HIGH-level input voltage
I_LIL
LOW-level input leakage
current
I_LIH
HIGH-level input leakage
current
V_i = 0 V
V_i = V_DD
−
−
0.3V_DD
V
0.7V_DD −
−
V
−
−
20
µA
−
−
20
µA
Notes
1. I_DD in all configurations include the current at pins V_DD, V_DDA and V_DDRAM.
2. Values given for program executed from internal ROM. Current consumption may be higher if program is executed
from external ROM or if charges are present on I/O ports.
3. A ceramic multilayer capacitor having a minimum value of 100 nF with a low ESR should be used to obtain these
specifications.
4. The I/O line has an integrated 10 kΩ pull-up resistor at pin V_CC.
5. Pins C4 and C8 have integrated 10 kΩ pull-up resistors at pin V_CC; ports P34 and P35 have integrated 20 kΩ pull-up
resistors at pin V_DD.
OPTIONS
Table 12 Options
FEATURES
Alarm
Presence
MOVEC protection
active HIGH
active HIGH
on
OPTIONS
active LOW
active LOW
off
2000 Feb 21
32