TDA8006 Datasheet, PDF (30/40 Pages) NXP Semiconductors – Multiprotocol IC Card coupler

Philips Semiconductors
Multiprotocol IC Card coupler
Product specification
TDA8006
SYMBOL
PARAMETER
Card supply voltage (pin V_CC); note 3
V_O(VCC)
card supply output voltage
I_O(VCC)
card supply output current
I_CC(sd)
SR
shutdown current at pin V_CC
slew rate
Data line (pin I/O); note 4
V_o(I/O)
output voltage
I_o(I/O)
V_OL
V_OH
V_IL
V_IH
I_IL
I_LIH
t_i(r)
t_i(f)
t_o(r)
t_o(f)
R_pu(int)
output current
LOW-level output voltage
HIGH-level output voltage
LOW-level input voltage
HIGH-level input voltage
LOW-level input current
HIGH-level input leakage
current
input rise time
input fall time
output rise time
output fall time
internal pull-up resistance
between I/O and V_CC
CONDITIONS
MIN.
inactive
no load
0
I_O(VCC) = 1 mA
0
pin grounded
0
active
I_CC < 65 mA; 5 V card
4.75
I_CC < 65 mA; 3 V card
2.8
current pulses of 40 nAs with 4.6
I_CC < 200 mA; t < 400 ns;
f < 20 MHz; 5 V card
current pulses of 24 nAs with 2.75
I_CC < 200 mA; t < 400 ns;
f < 20 MHz; 3 V card
from 0 to 3 or 5 V
−
V_CC short circuited to GND
−
−
up or down
0.10
(capacitor = 100 to 300 nF)
inactive
no load
I_o(I/O) = 1 mA
inactive and pin grounded
I/O configured as output;
I_OL = 1 mA
I/O configured as output;
I_OH < −50 µA
I/O configured as input
I/O configured as input
V_IL = 0 V
V_IH = V_CC
C_L = 30 pF
C_L = 30 pF
C_L = 30 pF
C_L = 30 pF
0
−
0
0
0.8V_CC
−0.3
1.5
−
−
−
−
−
−
8
TYP. MAX. UNIT
−
0.1
−
0.3
−
−1
5
5.25
3
3.2
−
5.4
−
3.25
−
65
−
250
−80 −
0.16 0.22
V
V
mA
V
V
V
V
mA
mA
mA
V/µs
−
0.1
V
−
0.3
V
−
−1
mA
−
0.3
V
−
V_CC + 0.25 V
−
+0.8
V
−
V_CC
V
−
−600
µA
−
20
µA
−
1
µs
−
1
µs
−
0.1
µs
−
0.1
µs
10 13
kΩ
2000 Feb 21
30